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Pradeep Lall to lead Auburn University's new Electronics Packaging Research Institute
The research institute will focus on semiconductor research and innovation.
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Pradeep Lall. / Image – Auburn University
Auburn University has appointed Pradeep Lall, the John and Anne MacFarlane Endowed Distinguished Professor and alumni professor in the Department of Mechanical Engineering, to lead its newly established Electronics Packaging Research Institute (EPRI).
The institute, a significant expansion of Auburn's ongoing semiconductor packaging research, builds on the work of the Center of Advanced Vehicle and Extreme Environment Electronics (CAVE3), which Lall has directed since 2008.
The creation of EPRI highlights the growing emphasis on domestic semiconductor packaging capabilities, an area that has gained national prominence following the recent establishment of the National Advanced Packaging Manufacturing Program (NAPMP) under the CHIPS Act.
“Our need for domestic capability in manufacturing, research and development for semiconductor packaging has really entered the national conversation recently with the recent establishment of the National Advanced Packaging Manufacturing Program (NAPMP) under the Creating Helpful Incentives to Produce Semiconductors — or CHIPS — Act,” Lall said.
Auburn’s research in semiconductor packaging, particularly under Lall's leadership, has experienced significant growth over the past decade. The university's contributions to the NextFlex National Manufacturing Institute, where Lall serves on the technical council, underscore Auburn's commitment to advancing U.S. manufacturing of flexible hybrid electronics.
The new institute will collaborate with various campus offices and colleges, including the Auburn University Research and Technology Park (ARTP) and the College of Science and Mathematics. EPRI aims to further Auburn's mission of advancing electronics packaging technologies and enhancing its reputation as a global leader in the field.
EPRI will also focus on workforce development, technology commercialization, and new product launches, positioning Auburn University at the forefront of the national emphasis on advanced electronics manufacturing.
Lall holds joint courtesy appointments in the departments of electrical and computer engineering and finance. He has authored or co-authored over 900 publications, including books, book chapters, and numerous journal and conference papers in the fields of electronics reliability, manufacturing, and energy efficiency. He is a fellow of organizations such as ASME, IEEE, and the NextFlex National Manufacturing Institute.
Lall holds an M.S. and Ph.D. in mechanical engineering from the University of Maryland, and an MBA from the Kellogg School of Management at Northwestern University.
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